●  Multi process chambers

 ●  High or Ultra-high vacuum pressure

 ●  Process including sputtering, e-beam, thermal evaporation, IAD, degas, oxidation, cooling, pre-cleaning, etc.

 ●  Metal, oxide or nitride deposition for Fab

 ●  Custom substrate fixture

 ●  Excellent film uniformity and quality

 ●  Robot substrate transfer

 ●  Load Lock

 ●  EFEM

 ●  Automatic control